工作描述
我們正在尋找一位才華橫溢的射頻工程師,在光學(xué)芯片射頻結(jié)構(gòu)的設(shè)計(jì)和開(kāi)發(fā)中發(fā)揮關(guān)鍵作用。在此職位中,您將負(fù)責(zé)設(shè)計(jì)、仿真和測(cè)試與光學(xué)芯片的射頻結(jié)構(gòu)。您將與跨職能團(tuán)隊(duì)密切合作,確保產(chǎn)品滿足射頻性能要求。
(一)崗位職責(zé):
1、負(fù)責(zé)設(shè)計(jì)和仿真光學(xué)芯片中的射頻結(jié)構(gòu)和各類(lèi)射頻基板,滿足產(chǎn)品的射頻性能需求。
2、與光學(xué)工程師和芯片設(shè)計(jì)師合作,將射頻組件無(wú)縫集成到光學(xué)芯片架構(gòu)中。
3、執(zhí)行電磁仿真和分析以優(yōu)化射頻性能,包括阻抗匹配、信號(hào)完整性等。
4、使用仿真工具和硬件原型開(kāi)發(fā)用于測(cè)試和驗(yàn)證的原型射頻電路和系統(tǒng)。
5、使用矢量網(wǎng)絡(luò)分析儀、頻譜分析儀和示波器等實(shí)驗(yàn)室設(shè)備表征射頻組件和系統(tǒng)。
6、分析測(cè)試數(shù)據(jù)并迭代設(shè)計(jì)以提高性能并滿足設(shè)計(jì)規(guī)范。
7、與制造團(tuán)隊(duì)密切合作,確保從原型到生產(chǎn)的無(wú)縫過(guò)渡,包括可制造性設(shè)計(jì)考慮因素。
8、及時(shí)了解射頻設(shè)計(jì)方法、工具和技術(shù)的行業(yè)趨勢(shì)和進(jìn)步。
9、幫助記錄設(shè)計(jì)規(guī)范、測(cè)試程序和設(shè)計(jì)驗(yàn)證計(jì)劃。
(二)任職要求:
1、電子、射頻或相關(guān)領(lǐng)域的博士或碩士學(xué)位。
2、對(duì)射頻電路理論和設(shè)計(jì)原理有深入的了解。
3、熟練使用射頻仿真工具,例如 Keysight ADS、Ansys HFSS或CST。
4、擁有射頻測(cè)試設(shè)備的實(shí)踐經(jīng)驗(yàn),包括矢量網(wǎng)絡(luò)分析儀、頻譜分析儀和示波器。
5、強(qiáng)大的溝通和協(xié)作能力,能夠在跨職能團(tuán)隊(duì)中有效工作。
6、能夠在動(dòng)態(tài)環(huán)境中獨(dú)立工作并管理多項(xiàng)任務(wù)。
7、具有出色的解決問(wèn)題的能力和對(duì)細(xì)節(jié)的關(guān)注。
優(yōu)先資質(zhì):
1、擁有射頻設(shè)計(jì)開(kāi)發(fā)工作經(jīng)驗(yàn)。
2、熟悉光通信系統(tǒng)和組件。
3、擁有射頻集成電路設(shè)計(jì)和布局經(jīng)驗(yàn)。
4、了解半導(dǎo)體制造工藝和封裝技術(shù)。
工作描述:
我們正在尋找技術(shù)精湛的可靠性工程師,以確保我們光學(xué)芯片的可靠性和穩(wěn)健性。在此職位上,您將與工程師團(tuán)隊(duì)密切合作,以確定潛在的故障機(jī)制、制定測(cè)試計(jì)劃并分析數(shù)據(jù)以提高芯片的可靠性。您將利用您在可靠性測(cè)試、故障分析和統(tǒng)計(jì)分析方面的專(zhuān)業(yè)知識(shí)來(lái)制定和實(shí)施策略,以確保芯片滿足所需的可靠性和質(zhì)量標(biāo)準(zhǔn)。
Job Description:
We are seeking a highly skilled Reliability Engineer to ensure the reliability and robustness of our optical chips. In this role, you will work closely with a team of engineers to identify potential failure mechanisms, develop test plans, and analyze data to improve the chip's reliability. You will use your expertise in reliability testing, failure analysis, and statistical analysis to develop and implement strategies that ensure the chip meets the requir edreliability and quality standards.
崗位職責(zé):
1.制定并執(zhí)行可靠性測(cè)試計(jì)劃,確定可能的失效模型和機(jī)理。
2.對(duì)光芯片進(jìn)行失效分析,確定失效根本原因并提出修改措施。
3.開(kāi)發(fā)和維護(hù)可靠性模型,預(yù)測(cè)和提高芯片的可靠性性能。
4.分析可靠性數(shù)據(jù)并生成報(bào)告以確定趨勢(shì)并提出改進(jìn)建議。
5.與設(shè)計(jì)、工藝和制造團(tuán)隊(duì)協(xié)作,確保將可靠性要求納入產(chǎn)品開(kāi)發(fā)過(guò)程。
6.開(kāi)發(fā)和維護(hù)可靠性文檔,包括失效分析報(bào)告、可靠性模型和測(cè)試流程。
7.及時(shí)了解可靠性測(cè)試和分析方法的行業(yè)趨勢(shì)和進(jìn)步。
8.產(chǎn)品可靠性驗(yàn)證方案制定(包括量產(chǎn)、研發(fā)和工程變更的產(chǎn)品)。
9.根據(jù)半導(dǎo)體器件相關(guān)行業(yè)標(biāo)準(zhǔn)及客戶要求,制定并執(zhí)行廠內(nèi)可靠性驗(yàn)證計(jì)劃。
Key Responsibilities:
1.Develop and execute reliability test plans to identify potential failure modes and mechanisms.
2.Conduct failure analysis on optical chips to determine root cause of failures and recommend corrective actions.
3.Develop and maintain reliability models to predict and improve the chip's reliability performance.
4.Analyze reliability data and generate reports to identify trends and make recommendations for improvements.
5.Collaborate with design, process, and manufacturing teams to ensure reliability requirements are incorporated into the product development process.
6.Develop and maintain reliability documentation, including failure analysis reports, reliability models, and test procedures.
7. Stay up-to-date with industry trends and advancements in reliability testing and analysis methodologies.
8.Develop product reliability verification scheme (including mass production, R&D and engineering change products).
9.Develop and implement in-plant reliability verification plan according to semiconductor device industry standards and customer requirements.
任職要求:
1.電子工程、數(shù)理統(tǒng)計(jì)、物理、材料科學(xué)或相關(guān)專(zhuān)業(yè)博士學(xué)位。
2.3年以上可靠性工程經(jīng)驗(yàn),半導(dǎo)體行業(yè)優(yōu)先。
3.對(duì)半導(dǎo)體器件物理和可靠性機(jī)制有深入了解。
4.熟悉可靠性試驗(yàn)設(shè)備,如老化柜等。
5.有JMP、Minitab等統(tǒng)計(jì)分析工具使用經(jīng)驗(yàn)。
6.開(kāi)發(fā)和維護(hù)可靠性模型和仿真的經(jīng)驗(yàn)。
7.能夠使用統(tǒng)計(jì)方法和工具分析和解釋數(shù)據(jù)。
8.解決問(wèn)題能力強(qiáng),注重細(xì)節(jié)。
9.優(yōu)秀的英文口頭和書(shū)面溝通能力。
10.能夠在團(tuán)隊(duì)環(huán)境中獨(dú)立和協(xié)作地工作。
Job Requirements:
1.Phd 's degree in Electrical Engineering, Mathematical statistics, physics ,Materials Science,or a related field.
2. 3+ years of experience in reliability engineering, preferably in the semiconductor industry.
3. Strong understanding of semiconductor device physics and reliability mechanisms.
4. Familiarity with reliability test equipment, such as aging cabinet.
5. Experience with statistical analysis tools, such as JMP or Minitab.
6. Experience in developing and maintaining reliability models and simulations.
7. Ability to analyze and interpret data using statistical methods and tools.
8. Strong problem-solving skills and attention to detail.
9. Excellent oral and written communication skills in English.
10. Ability to work independently and collaboratively in a team environment.
優(yōu)先資質(zhì):
1.有激光器、調(diào)制器、探測(cè)器等光器件可靠性測(cè)試經(jīng)驗(yàn)。
2.熟悉可靠性標(biāo)準(zhǔn),如Telcordia GR-468-CORE或MIL-STD-883。
3.有SEM、TEM、FIB等失效分析技術(shù)經(jīng)驗(yàn)。
4.熟悉加速壽命試驗(yàn)等可靠性分析工具。
5.有半導(dǎo)體制造和封裝工藝經(jīng)驗(yàn)。
Preferred Qualifications:
1. Experience with reliability testing of optical components, such as lasers, modulators, and detectors.
2. Familiarity with reliability standards, such as Telcordia GR-468-CORE or MIL-STD-883.
3. Experience with failure analysis techniques, such as SEM, TEM, or FIB.
4. Familiarity with reliability analysis tools, such as accelerated life testing.
5. Experience with semiconductor fabrication and packaging processes.
工作描述:
我們正在尋找一位積極進(jìn)取的測(cè)試工程師來(lái)設(shè)計(jì)和開(kāi)發(fā)用于光學(xué)芯片高速測(cè)量的創(chuàng)新測(cè)試解決方案。在此職位上,您將與工程師團(tuán)隊(duì)密切合作,以確定測(cè)試需求、設(shè)計(jì)測(cè)試夾具并執(zhí)行測(cè)試計(jì)劃。您將利用您在光學(xué)測(cè)試、數(shù)據(jù)分析和自動(dòng)化方面的專(zhuān)業(yè)知識(shí)來(lái)開(kāi)發(fā)滿足產(chǎn)品要求的可靠且高效的測(cè)試系統(tǒng)。
Job Description:
We are seeking a highly motivated Test Engineer to design and develop innovative testing solutions for high-speed measurement of optical chips. In this role, you will work closely with a team of engineers to identify test requirements, design test fixtures, and execute test plans. You will use your expertise in optical testing, data analysis, and automation to develop reliable and efficient test systems that meet product requirements.
崗位職責(zé):
1.制定并執(zhí)行測(cè)試計(jì)劃以驗(yàn)證光學(xué)芯片的性能和功能。
2.使用各種測(cè)試設(shè)備和工具,設(shè)計(jì)和開(kāi)發(fā)用于光芯片測(cè)量的測(cè)試裝備。
3.負(fù)責(zé)高速光電測(cè)試系統(tǒng)的設(shè)計(jì)與搭建,確保測(cè)試系統(tǒng)的準(zhǔn)確性與重復(fù)性。
4.負(fù)責(zé)新產(chǎn)品射頻基板的設(shè)計(jì)仿真與測(cè)試驗(yàn)證導(dǎo)入。
5.負(fù)責(zé)新產(chǎn)品高速光電測(cè)試指標(biāo)與客戶對(duì)標(biāo)。
6與跨職能團(tuán)隊(duì)合作,了解產(chǎn)品需求并確保測(cè)試滿足這些需求。
7.分析測(cè)試數(shù)據(jù)以確定趨勢(shì)、問(wèn)題和改進(jìn)機(jī)會(huì)。
8.自動(dòng)化測(cè)試流程以提高效率并減少測(cè)試時(shí)間。
9.對(duì)測(cè)試設(shè)備、夾具和軟件進(jìn)行故障排除和調(diào)試。
10.以清晰簡(jiǎn)潔的方式記錄測(cè)試程序、結(jié)果和建議。
11.緊跟行業(yè)趨勢(shì)和光學(xué)測(cè)試技術(shù)的進(jìn)步。
Key Responsibilities:
1. Develop and execute test plans to validate optical chips' performance and functionality.
2. Design and develop test fixtures for optical chip measurements using various test equipment and tools.
3.Responsible for the design and construction of a high-speed optoelectronic testing system, ensuring the accuracy and repeatability of the testing system.
4.Responsible for the design simulation and testing validation import of new product RF substrates.
5.Responsible for the high-speed optoelectronic testing indicators of new products and customer benchmarking.
6.Collaborate with cross-functional teams to understand product requirements and ensure that tests meet those requirements.
7.Analyze test data to identify trends, issues, and opportunities for improvement.
8.Automate testing processes to increase efficiency and reduce testing time.
9.Troubleshoot and debug test equipment, fixtures, and software.
10. Document test procedures, results, and recommendations in a clear and concise manner.
11. Stay up-to-date with industry trends and advancements in optical testing technologies.
任職要求:
1.電子工程、光學(xué)工程或相關(guān)專(zhuān)業(yè)博士學(xué)位。
2.2年以上光學(xué)測(cè)試經(jīng)驗(yàn),半導(dǎo)體行業(yè)、射頻及微帶電路設(shè)計(jì)與仿真經(jīng)驗(yàn)或高速光電系統(tǒng)設(shè)計(jì)經(jīng)驗(yàn)者優(yōu)先。
3.對(duì)激光器、調(diào)制器、探測(cè)器等光學(xué)元件有深入了解。
4.熟悉測(cè)試設(shè)備,如示波器、頻譜分析儀、功率計(jì)等。
5.具有使用腳本語(yǔ)言(例如 Python、LabVIEW、MATLAB)進(jìn)行編程和自動(dòng)化的經(jīng)驗(yàn)。
6.熟練使用ADS、HFSS、EMP等仿真軟件。
7.能夠使用統(tǒng)計(jì)方法和工具分析和解釋數(shù)據(jù)。
8.解決問(wèn)題能力強(qiáng),注重細(xì)節(jié)。
9.優(yōu)秀的英文口頭和書(shū)面溝通能力,能夠閱讀專(zhuān)業(yè)設(shè)備說(shuō)明書(shū),行業(yè)標(biāo)準(zhǔn)等英文文件。
10.能夠在團(tuán)隊(duì)環(huán)境中獨(dú)立和協(xié)作地工作。
Job Requirements:
1.Phd's degree in Electrical Engineering, Optical Engineering, or a related field.
2.2+ years of experience in optical testing, experience, semiconductor industry, RF and microstrip circuit design and simulation experience or high speed photoelectric system design experience is preferred.
3.Strong understanding of optical components, such as lasers, modulators, and detectors.
4. Familiarity with testing equipment, such as oscilloscopes, spectrum analyzers, and power meters.
5.Experience in programming and automation using scripting languages (e.g., Python, LabVIEW, MATLAB).
6.Proficient in ADS, HFSS, EMP and other simulation software
7.Ability to analyze and interpret data using statistical methods and tools.
8.Strong problem-solving skills and attention to detail.
9.Excellent oral and written communication skills in English,Be able to read professional equipment specifications, industry standards and other English documents.
10.Ability to work independently and collaboratively in a team environment.
優(yōu)先資質(zhì):
1.有高速光測(cè)試經(jīng)驗(yàn)(如100Gbps及以上)。
2.熟悉光通信系統(tǒng)和標(biāo)準(zhǔn)(例如PON、數(shù)據(jù)中心)。
3.有半導(dǎo)體制造和封裝工藝經(jīng)驗(yàn)。
Preferred Qualifications:
1. Experience with high-speed optical testing (e.g., 100 Gbps and above).
2. Familiarity with optical communication systems and standards (e.g., PON, Data Center).
3. Experience with semiconductor fabrication and packaging processes.
崗位職責(zé):
1、負(fù)責(zé)新產(chǎn)品的有源區(qū),光波導(dǎo)的仿真與設(shè)計(jì),確保產(chǎn)品光電特性符合預(yù)期要求;
2、負(fù)責(zé)與市場(chǎng)部對(duì)接,收集行業(yè)發(fā)展趨勢(shì)信息,獲取客戶對(duì)產(chǎn)品的需求反饋,定期舉行內(nèi)部研討,推動(dòng)新品研發(fā)立項(xiàng);
3、負(fù)責(zé)新產(chǎn)品的知識(shí)產(chǎn)權(quán)文件的編寫(xiě)與部署。
任職要求:
1、光信息科學(xué)與技術(shù)、光電子技術(shù)科學(xué)、光電子材料與器件、光電信息工程等相關(guān)專(zhuān)業(yè)博士/碩士學(xué)位;
2、六級(jí)以上英文水平,要求能夠閱讀并理解相關(guān)英文文獻(xiàn),并能夠利用英文完成技術(shù)溝通工作;
3、具有通訊用激光器設(shè)計(jì)相關(guān)軟件使用經(jīng)驗(yàn)者優(yōu)先。
崗位職責(zé):
1、負(fù)責(zé)新產(chǎn)品的高頻電路的設(shè)計(jì)與仿真,高頻測(cè)試平臺(tái)的設(shè)計(jì)與搭建,確保產(chǎn)品高頻測(cè)試可準(zhǔn)確反饋并改進(jìn);
2、負(fù)責(zé)解決新產(chǎn)品在高頻工藝中遇到的工藝異常,確保工藝異常閉環(huán),新產(chǎn)品順利轉(zhuǎn)產(chǎn);
3、負(fù)責(zé)編制新產(chǎn)品高頻工藝文件,并培訓(xùn)相關(guān)操作人員;
4、協(xié)助產(chǎn)品經(jīng)理分析定位產(chǎn)品在高頻工藝中的問(wèn)題并解決。
任職要求:
1、電子信息工程、通信工程相關(guān)專(zhuān)業(yè)博士/碩士學(xué)位;
2、熟練使用仿真軟件;
3、六級(jí)以上英文水平,要求能夠閱讀并理解相關(guān)設(shè)備英文文獻(xiàn)。
崗位職責(zé):
1.領(lǐng)導(dǎo)項(xiàng)目規(guī)劃、范圍界定和進(jìn)度安排活動(dòng),負(fù)責(zé)新產(chǎn)品的技術(shù)方案的制定,測(cè)試結(jié)果的分析,確保新產(chǎn)品按照計(jì)劃節(jié)點(diǎn)滿足相應(yīng)的技術(shù)指標(biāo)并最終順利量產(chǎn)。
2.制定和維護(hù)項(xiàng)目計(jì)劃,包括工作分解結(jié)構(gòu)、資源分配和風(fēng)險(xiǎn)管理計(jì)劃。
3.定期向利益相關(guān)者傳達(dá)項(xiàng)目狀態(tài)、問(wèn)題和風(fēng)險(xiǎn)。
4.負(fù)責(zé)收集行業(yè)發(fā)展趨勢(shì)信息,獲取客戶對(duì)產(chǎn)品的需求反饋,定期舉行內(nèi)部研討,推動(dòng)新技術(shù)的研發(fā)立項(xiàng)。
5.管理項(xiàng)目預(yù)算并跟蹤項(xiàng)目成本以確保遵守預(yù)算限制。
6.協(xié)調(diào)跨職能團(tuán)隊(duì),確保按時(shí)完成項(xiàng)目任務(wù)。
7.促進(jìn)項(xiàng)目會(huì)議,包括狀態(tài)更新、問(wèn)題解決和決策制定。
8.通過(guò)制定應(yīng)急計(jì)劃和主動(dòng)管理風(fēng)險(xiǎn)來(lái)識(shí)別和減輕項(xiàng)目風(fēng)險(xiǎn)。
9.確保項(xiàng)目可交付成果符合質(zhì)量標(biāo)準(zhǔn)并實(shí)現(xiàn)項(xiàng)目目標(biāo)。
10.為項(xiàng)目團(tuán)隊(duì)成員提供領(lǐng)導(dǎo)和指導(dǎo),以確保項(xiàng)目成功。
11.負(fù)責(zé)新產(chǎn)品的知識(shí)產(chǎn)權(quán)文件的編寫(xiě)與部署。
Key Responsibilities:
1.Lead project planning, scoping, and scheduling activities, Responsible for the formulation of technical solutions for new products, analysis of test results, to ensure that the new products meet the corresponding technical indicators according to the planned nodes and the final successful mass production.
2.Develop and maintain project plans, including work breakdown structures, resource allocation, and risk management plans.
3.Communicate project status, issues, and risks to stakeholders on a regular basis.
4.Responsible for collecting industry development trend information, obtaining customer demand feedback on products, holding internal discussion regularly, promoting new technology research and development project.
5.Manage project budgets and track project costs to ensure adherence to budget constraints.
6.Coordinate cross-functional teams to ensure timely completion of project tasks.
7.Facilitate project meetings, including status updates, issue resolution, and decision-making.
8.Identify and mitigate project risks by developing contingency plans and proactively managing risks.
9.Ensure project deliverables meet quality standards and project goals and objectives are achieved.
10.Provide leadership and guidance to project team members to ensure project success.
11.Responsible for the preparation and deployment of intellectual property documents for new products.
任職要求:
1.光信息科學(xué)與技術(shù),光電子技術(shù)科學(xué),光電子材料與器件,光電信息工程、工學(xué)、工商管理等相關(guān)專(zhuān)業(yè)博士/碩士學(xué)位。
2.具有3年以上半導(dǎo)體激光器,LED,PD設(shè)計(jì)、項(xiàng)目管理經(jīng)驗(yàn),科技行業(yè)優(yōu)先。
3.對(duì)項(xiàng)目管理方法、工具和技術(shù)有深入的了解。
4.成功管理復(fù)雜項(xiàng)目的良好記錄,包括跨職能團(tuán)隊(duì)和預(yù)算。
5.優(yōu)秀的溝通、領(lǐng)導(dǎo)和人際交往能力。
6.解決問(wèn)題能力強(qiáng),注重細(xì)節(jié)。
7.能夠同時(shí)管理多個(gè)項(xiàng)目。
8.具有風(fēng)險(xiǎn)管理、變更管理和利益相關(guān)者管理方面的經(jīng)驗(yàn)。
9.熟練使用Microsoft Project、Smartsheet等項(xiàng)目管理軟件, 具有Crosslight,Lumerical,Comsol使用經(jīng)驗(yàn)者優(yōu)先。
10.PMP或其他項(xiàng)目管理認(rèn)證者優(yōu)先。
11.六級(jí)以上英文水平,要求能夠閱讀并理解相關(guān)英文文獻(xiàn),并能夠利用英文完成技術(shù)溝通工作,良好的英語(yǔ)口語(yǔ),能與各地溝通。
Job Requirements:
1.Doctor's or Master's degree in Engineering, Optical Information Science and Technology, Optoelectronic technology Science, Optoelectronic Materials and devices, Optoelectronic Information Engineering, Business Administration, or a related field.
2.3+ years of experience in semiconductor laser, LED, PD design is preferred, project management, preferably in a technology industry.
3.Strong understanding of project management methodologies, tools, and techniques.
4.Proven track record of successfully managing complex projects, including cross-functional teams and budgets.
5.Excellent communication, leadership, and interpersonal skills.
6.Strong problem-solving skills and attention to detail.
7.Ability to manage multiple projects simultaneously.
8.Experience in risk management, change management, and stakeholder management.
9.Proficiency in project management software, such as Microsoft Project or Smartsheet. Experience with Crosslight, Lumerical, Comsol is preferred.
10.PMP or other project management certification is a plus.
11.CET-6 or above, must be able to read and understand relevant English literature, and be able to complete technical communication in English. Good Spoken English to communicate with all regions.
優(yōu)先資質(zhì):
1.有半導(dǎo)體行業(yè)經(jīng)驗(yàn)。
2.了解光芯片技術(shù)和制造工藝。
3.有產(chǎn)品開(kāi)發(fā)經(jīng)驗(yàn),從概念到市場(chǎng)投放。
Preferred Qualifications:
1. Experience in the semiconductor industry.
2. Knowledge of optical chip technology and manufacturing processes.
3. Experience in product development, from concept to market launch.